Power Module Packaging Market 2022 : Global Industry Size, Analysis, Trends, and Regional Forecast by 2032 | Emergen Research

 Global  Power Module Packaging Market research report by Emergen Research offers strategic insights into the  Power Module Packaging market business sphere and in-depth analysis of the industrial chain analysis, value chain analysis, upstream raw materials, investment strategies, regional expansions, and competitive landscape. For stakeholders, field marketing executives and product owners planning to maintain a competitive edge the market assessment report brings to light essential impression about the growth rate, share and size of the industry during the estimated period. Deep dive into an array of elements including but not limited to the value proposition, product positioning, and targeting and industry segmentation have been described through resources such as charts, tables, and info graphics.

The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.

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Key companies operating in the market include:

SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc

The research study examines historic data from 2018 and 2020 to draw forecasts until 2028. The timeline makes the report an invaluable resource for readers, investors, and stakeholders looking for key insights in readily accessible documents with the information presented in the form of tables, charts, and graphs.

What does this Report Deliver?

Market Estimation for 20+ Countries

Customization on Segments, Regions, and Company Profiles

100+ tables, 150+ Figures

Global and Country Market Trends

Comprehensive Mapping of Industry Parameters

Attractive Investment Proposition

Competitive Strategies Adopted by Leading Market Participants

Market drivers, restraints, opportunities, and their impact on the market

Market growth rate till  2028   

Segments Covered in this report are:

  • Power Module Type Outlook (Revenue, USD Billion; 2019-2032)

    • Silicon Carbide (SiC) Module
    • Gallium Nitride (GaN) Module
    • Insulated-Gate Bipolar Transistor (IGBT) Module
    • Field-Effect Transistor (FET) Module
    • Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
    • Others

  • Technology Outlook (Revenue, USD Billion; 2019-2032)

    • Standard Packaging
    • Advanced Packaging
    • Pressure-Contact Modules
    • Others

  • Thermal type Outlook (Revenue, USD Billion; 2019-2032)

    • Liquid-Cooled
    • Air-Cooled
    • Hybrid

The report considers the following timeline for market estimation:

  • Historical Years: 2017-2018
  • Base Year: 2019
  • Estimated Year: 2032
  • Forecast Years: 2024-2032

Each section of the report reveals critical information about the global  Power Module Packaging Market that could be used to ensure strong growth in the coming years. Our unique blend of primary and secondary research techniques helped us to recognize hidden business opportunities available in the global Power Module Packaging Market , besides collecting significant insights of market participants and obtaining precise market data. It includes several research studies such as manufacturing cost analysis, absolute dollar opportunity, pricing analysis, company profiling, production and consumption analysis, and market dynamics.

To learn more details about the Global  Power Module Packaging Market report, visit @ https://www.emergenresearch.com/industry-report/power-module-packaging-market

Power Module Packaging Market research report depicts the latest market scenario with updated trends and segmentation of the products and services. The study provides crucial information on the market situation, size, share, growth factors of the  Power Module Packaging Market

Overview of the  Power Module Packaging Market Report:

  • Introduction, Product Scope, Power Module Packaging Market Overview, and Opportunities
  • Analysis of the Manufacturers with sales, revenue, and price analysis
  • Comprehensive analysis of the competitive landscape
  • Extensive profiling of the key competitors along with their business strategies and market size
  • Regional analysis of the market along with sales, revenue, market share, and global position
  • Country-wise analysis of the market along with types, applications, and manufacturing
  • Strategic recommendations to established players as well as new entrants
  • In-depth analysis of the risks, restraints, and limitations in the Power Module Packaging Market industry

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TOC of the global Power Module Packaging Market report:

Chapter 1, describes the Power Module Packaging Market  Introduction, market overview, product offerings, growth opportunities, market risks, driving forces, and challenges.

Chapter 2, analyzes the key manufacturers of Power Module Packaging Market , along with the sales, revenue, and price of Power Module Packaging Market , in the forecast period.

Chapter 3, studies the competitive situation among the major manufacturers and vendors, with sales, revenue, and market share.

Chapter 4, analyzes the global market by regions, with sales, revenue, and market share of Power Module Packaging Market, for each region, from 2020 to 2032.

Chapters 5, 6, 7, 8 and 9, analyze the Power Module Packaging Market  by type, application, regions, and manufacturers, with sales, revenue, and market share by key countries in these regions…Continued

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